FreeCalypso > hg > gsm-net-reveng
comparison tcsm2-notes/trco @ 18:b36419bbc2c4
tcsm2-notes/trco: update after peeling off IC stickers
| author | Mychaela Falconia <falcon@freecalypso.org> |
|---|---|
| date | Wed, 29 May 2024 23:11:28 +0000 |
| parents | 776229c5d640 |
| children |
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| 17:776229c5d640 | 18:b36419bbc2c4 |
|---|---|
| 1 Major components on TRCO board: | 1 Major components on TRCO board: |
| 2 | 2 |
| 3 1x Lattice ispLSI1032E PLD, same as on TR16-S | 3 1x Lattice ispLSI1032E PLD, same as on TR16-S |
| 4 1x CPU: Intel TN80C186EB20 | 4 1x CPU: Intel TN80C186EB20 |
| 5 | 5 |
| 6 1x really big oscillator component, labeled 16.384 MHz, likely OCXO (or TCXO?) | 6 Big oscillator, markings on the metal can package: |
| 7 1x MAS9316N DAC close to it - likely TDM common clock for the system | 7 |
| 8 DFA 36-TR | |
| 9 16.384 MHz | |
| 10 A36060 0049 | |
| 11 | |
| 12 Close to it there is a MAS9316N DAC - thus the big oscillator is likely the | |
| 13 system-wide TDM clock (the one that can be synced to various inputs), and the | |
| 14 DAC is for control loop adjustments aiming to lock this oscillator to the | |
| 15 selected external clock source. Based on the size of the can, I originally | |
| 16 thought it was an OCXO, but when I searched for "DFA 36-TR", the hits I got | |
| 17 (only sellers, no datasheet) say TCXO. Who knows... | |
| 8 | 18 |
| 9 3x Infineon chips, 2x SAB 82525 (2x HDLC) and 1x SAB 82526 (1x HDLC): | 19 3x Infineon chips, 2x SAB 82525 (2x HDLC) and 1x SAB 82526 (1x HDLC): |
| 10 the 5 HDLC channels which the available documentation touches on | 20 the 5 HDLC channels which the available documentation touches on. |
| 11 | 21 |
| 12 8x PLCC32 chips (9 pins on wide side, 7 pins on narrow side) with stickers | 22 8x PLCC32 chips (9 pins on wide side, 7 pins on narrow side) with stickers |
| 13 on them that obscure the markings underneath. The markings read IC45 through | 23 on them that obscure the markings underneath. The markings read IC45 through |
| 14 IC48 in the top row of 4, IC55 through IC58 in the bottom row of 4. All 8 | 24 IC48 in the top row of 4, IC55 through IC58 in the bottom row of 4. All 8 |
| 15 ICs are directly soldered. Suspected flash memory. | 25 ICs are directly soldered. Suspected flash memory. |
| 26 | |
| 27 Update with IC55 sticker peeled off: the IC underneath is AM29F010B-120JC, | |
| 28 just like I suspected. Interestingly, it also says "(C) 1998 AMD" - the year | |
| 29 is slightly newer than my original assumptions of 1996 vintage. | |
| 16 | 30 |
| 17 Next to these 8 ICs there is a socketed PLCC44 IC (11 pins on each side) | 31 Next to these 8 ICs there is a socketed PLCC44 IC (11 pins on each side) |
| 18 with a sticker that reads: | 32 with a sticker that reads: |
| 19 | 33 |
| 20 TRCO | 34 TRCO |
| 22 TC1ROMQL | 36 TC1ROMQL |
| 23 | 37 |
| 24 It is clearly a programmed part of some kind, but not clear if it is flash | 38 It is clearly a programmed part of some kind, but not clear if it is flash |
| 25 (boot code?) or some PLD or whatever. | 39 (boot code?) or some PLD or whatever. |
| 26 | 40 |
| 27 Further insight can be gained by peeling off the stickers, but I am not going | 41 Update after peeling off the sticker: the part is ST M27C4002, an OTP ROM! |
| 28 there yet: my current plan is to try powering this unit as-is and see if it | 42 It is clearly the boot PROM, whereas the other 8 ICs (all 29F010?) are the |
| 29 comes to life in a useful way. If it turns out to lack the needed fw, or lack | 43 flash memory array. The large size of both the flash array and the boot PROM |
| 30 TFO feature, then proceed further with reverse eng. | 44 is surprising: |
| 45 | |
| 46 * The boot PROM is 4 Mbit (256K x 16) - that's 512 KiB, half of 80186 address | |
| 47 space if fully and directly mapped. | |
| 48 | |
| 49 * Assuming that the 8 bit wide 29F010 chips are wired in pairs across the | |
| 50 16 bit wide data bus, we got 1 MiB in total, in 4 banks of 256 KiB each. | |
| 51 More than 80186 can address directly - is it a bank-switched memory system? | |
| 52 | |
| 53 RAM chips: | |
| 54 | |
| 55 * 2x Samsung K6T1008C2E-GL70. Each of these ICs is 128K x 8 static RAM; | |
| 56 the design probably uses two of them across the 16 bit wide data bus. | |
| 57 256 KiB of RAM here. | |
| 58 | |
| 59 * 1x CY62256-70SNC - 32K x 8 (256 Kbit) static RAM. What is it for??? |
